Application Engineering Director

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.
Diamond Foundry is revolutionizing industries with single-crystal diamond, the ultimate material for advanced electronics and thermal management. As the world's leading producer of lab-grown diamond, we are expanding our application engineering team to support our growing customer base in the semiconductor industry. We seek a highly motivated and experienced Application Engineering Manager to drive the adoption of our cutting-edge diamond solutions in advanced packaging and thermal applications.

Responsibilities

• Lead and grow the application engineering function focused on semiconductor packaging and thermal management applications. 
• Drive the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes. 
• Provide in-depth technical expertise on thermal management principles and material characterization.
• Collaborate with the R&D and product development teams to define product roadmaps, identify new application opportunities, and drive product improvements.

Requirements

• Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field with a minimum of 8+ years of experience in semiconductor packaging and/or thermal management applications.
• Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques, including advanced packaging basic understanding, including 2.5D/3D IC thermal solutions.  Demonstration of exceptional ability and accomplishments, including hands-on development, integration, troubleshooting, and implementation of solutions.  Ability to execute from concepts and R&D to scaling and mass production.
• Strong knowledge of the semiconductor industry, systems engineering, reliability and compliance demonstration, and technology transfers, particularly in advanced packaging and thermal management.
• Proven ability to lead and manage cross-functional engineering teams, coupled with excellent communication, presentation, and interpersonal skills to support both internal collaboration and external business development and customer engagement.
• Experience with high thermal conductivity materials and advanced packaging.